3DIC Compiler

The Industry’s Only Unified Exploration-to-Signoff Platform for 2.5D and 3D Multi-Die Designs

Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, delivers the highest levels of design efficiency for capacity and performance. It leverages a single data-model to integrate design, die-to-die routing, test and silicon lifecycle management, native system analysis, verification, and signoff in a single environment. Synopsys 3DSO.ai, industry's first autonomous AI optimization solution for 2.5D and 3D heterogeneous design and integration, seamlessly integrates with 3DIC Compiler to maximize system performance and quality of results at a rapid pace for thermal integrity, signal integrity, and power network design. Ensuring system technology co-optimization (STCO), Synopsys 3DIC Compiler is certified by all foundries and leveraged successfully by customers in dozens of designs.

Key Benefits

Unmatched Scalability
System-of-chips integration over hundreds of billions of transistors
High Productivity
Fast exploration and design using world-class implementation and analysis engines
Golden Signoff
Full spectrum design closure and convergence to optimal PPA/mm3

What's New

Explore our library of news, blogs, webinars and other helpful resources.

Featured Resources

In his Chiplet Summit keynote, Abhijeet Chakraborty, VP of Engineering at Synopsys, talks about how multi-die designs are now the mainstream and open up innovation in a wide range of applications.

Shankar Krishnamoorthy, GM, Silicon Realization Group, discusses how multi-die design is now being used in various market segments to overcome system challenges. 

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